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120 μm Low Density Film UV Cured No Solvent No Silicone Transfer No Residuals mainly for Tape application

SUZHOU HSF ELECTRONIC MATERIALS TECHNOLOGY CO., LTD.
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    Buy cheap 120 μm Low Density Film UV Cured No Solvent No Silicone Transfer No Residuals mainly for Tape application from wholesalers
     
    Buy cheap 120 μm Low Density Film UV Cured No Solvent No Silicone Transfer No Residuals mainly for Tape application from wholesalers
    • Buy cheap 120 μm Low Density Film UV Cured No Solvent No Silicone Transfer No Residuals mainly for Tape application from wholesalers
    • Buy cheap 120 μm Low Density Film UV Cured No Solvent No Silicone Transfer No Residuals mainly for Tape application from wholesalers
    • Buy cheap 120 μm Low Density Film UV Cured No Solvent No Silicone Transfer No Residuals mainly for Tape application from wholesalers

    120 μm Low Density Film UV Cured No Solvent No Silicone Transfer No Residuals mainly for Tape application

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    Brand Name : HSF
    Model Number : 120DG-DS1030-LPE
    Payment Terms : T/T, L/C
    Supply Ability : 80000kg per week
    Delivery Time : within 10 days
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    120 μm Low Density Film UV Cured No Solvent No Silicone Transfer No Residuals mainly for Tape application

    LDPE Release Film, D, 120micron, DG, UV Cured, Application of Tape, Sealing strip, No solvent or silicone transfer.


    1AppearanceNo air bubbles / stains / breakage / impuritiesMeasured data (Ref.)
    2SizeWidth (mm)1000 -0+61004
    Thickness (mm)0.120 ± 8%0.116
    3Max. Tension (N / 50mm)TD≥ 1520
    MD≥ 1521
    4Color differenceColorimeter E 3ok
    5Elongation @ break (%)TD≥ 230876
    MD≥ 230754
    6Surface Tension (Corona treatment)Dyne Value≥42 dyne48
    7Release Force (gf/25mm 20min.Finat 10)Inner5-107
    Outer20-3024
    8Subsequent Adhesion (%)Inner≥7588
    Outer≥7590
    9Winding directionCustomized-
    10Splice No.≤1-

    LDPE (high pressure low density polyethylene):


    Non-toxic, tasteless, odorless, translucent spherical or cylindrical particles, excellent low temperature resistance.

    chemical resistance, good extensibility, electrical insulation, but poor wetness, Flammable.

    Density: 0.910—0.9408G/CM3 (g/cm3), suitable for extrusion, blister, injection molding, vacuum, molding, and conversion

    molding and other processing methods. The crystallinity is 55-65%, and the crystal melting point is 108-126 °C.

    120 μm Low Density Film UV Cured No Solvent No Silicone Transfer No Residuals mainly for Tape application120 μm Low Density Film UV Cured No Solvent No Silicone Transfer No Residuals mainly for Tape application

    Quality 120 μm Low Density Film UV Cured No Solvent No Silicone Transfer No Residuals mainly for Tape application for sale
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